2003AFG

INTEL

2003AFG 由 INTEL 生产,采用 BGA 封装,芯微百年深圳仓库In stock。

In stock
Stock quantity
—
Lead time
To be confirmed
MOQ
No MOQ

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Full specifications

2003AFG specifications
Parameter Value
Part number2003AFG
ManufacturerINTEL
Category编程器BIOS芯片
Stock statusIn stock
PackageBGA
MOQNo MOQ
Lead timeTo be confirmed