216M0SAAGA53

WINBOND

216M0SAAGA53 由 WINBOND 生产,采用 QFP 封装,批号 08+,芯微百年深圳仓库In stock。

In stock
Stock quantity
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Lead time
To be confirmed
MOQ
No MOQ

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Full specifications

216M0SAAGA53 specifications
Parameter Value
Part number216M0SAAGA53
ManufacturerWINBOND
Category编程器BIOS芯片
Stock statusIn stock
PackageQFP
Date code08+
MOQNo MOQ
Lead timeTo be confirmed