31GF4L-5302E3/22

MIT

31GF4L-5302E3/22 由 MIT 生产,采用 SOT153 封装,批号 06+,芯微百年深圳仓库In stock。

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Full specifications

31GF4L-5302E3/22 specifications
Parameter Value
Part number31GF4L-5302E3/22
ManufacturerMIT
Category编程器BIOS芯片
Stock statusIn stock
PackageSOT153
Date code06+
MOQNo MOQ
Lead timeTo be confirmed