D06FSY2

AR

D06FSY2 由 AR 生产,采用 BGA 封装,批号 02+,芯微百年深圳仓库In stock。

In stock
Stock quantity
—
Lead time
To be confirmed
MOQ
No MOQ

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Full specifications

D06FSY2 specifications
Parameter Value
Part numberD06FSY2
ManufacturerAR
Category编程器BIOS芯片
Stock statusIn stock
PackageBGA
Date code02+
MOQNo MOQ
Lead timeTo be confirmed