DM74LS08MX

DLP

DM74LS08MX 由 DLP 生产,采用 BGA 封装,批号 06+,芯微百年深圳仓库In stock。

In stock
Stock quantity
—
Lead time
To be confirmed
MOQ
No MOQ

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Full specifications

DM74LS08MX specifications
Parameter Value
Part numberDM74LS08MX
ManufacturerDLP
Category编程器BIOS芯片
Stock statusIn stock
PackageBGA
Date code06+
MOQNo MOQ
Lead timeTo be confirmed