EM6325CXSP5B3.1

EMM

EM6325CXSP5B3.1 由 EMM 生产,采用 SOP 封装,批号 02+,芯微百年深圳仓库In stock。

In stock
Stock quantity
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Lead time
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MOQ
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Full specifications

EM6325CXSP5B3.1 specifications
Parameter Value
Part numberEM6325CXSP5B3.1
ManufacturerEMM
Category编程器BIOS芯片
Stock statusIn stock
PackageSOP
Date code02+
MOQNo MOQ
Lead timeTo be confirmed