L2323673

INTEL

L2323673 由 INTEL 生产,采用 DIP 封装,批号 8216+,芯微百年深圳仓库In stock。

In stock
Stock quantity
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Lead time
To be confirmed
MOQ
No MOQ

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Full specifications

L2323673 specifications
Parameter Value
Part numberL2323673
ManufacturerINTEL
Category编程器BIOS芯片
Stock statusIn stock
PackageDIP
Date code8216+
MOQNo MOQ
Lead timeTo be confirmed