MGB-CGBD-01

NINTENDO

MGB-CGBD-01 由 NINTENDO 生产,采用 DIP 封装,批号 10+,芯微百年深圳仓库In stock。

In stock
Stock quantity
—
Lead time
To be confirmed
MOQ
No MOQ

No public pricing for this part yet — Request a quote.

Request a quote Find alternates

Full specifications

MGB-CGBD-01 specifications
Parameter Value
Part numberMGB-CGBD-01
ManufacturerNINTENDO
Category编程器BIOS芯片
Stock statusIn stock
PackageDIP
Date code10+
MOQNo MOQ
Lead timeTo be confirmed