S-80827CLY-B
TI
S-80827CLY-B 由 TI 生产，采用 TSSOP 封装，批号 01+，芯微百年深圳仓库In stock。
In stock
- Stock quantity
- —
- Lead time
- To be confirmed
- MOQ
- No MOQ
No public pricing for this part yet — Request a quote.
Full specifications
| Parameter | Value |
|---|---|
| Part number | S-80827CLY-B |
| Manufacturer | TI |
| Category | 编程器BIOS芯片 |
| Stock status | In stock |
| Package | TSSOP |
| Date code | 01+ |
| MOQ | No MOQ |
| Lead time | To be confirmed |