S1D13716B02
SAMSUNG
S1D13716B02 由 SAMSUNG 生产，采用 TFBGA 封装，批号 07+，芯微百年深圳仓库In stock。
In stock
- Stock quantity
- —
- Lead time
- To be confirmed
- MOQ
- No MOQ
No public pricing for this part yet — Request a quote.
Full specifications
| Parameter | Value |
|---|---|
| Part number | S1D13716B02 |
| Manufacturer | SAMSUNG |
| Category | 编程器BIOS芯片 |
| Stock status | In stock |
| Package | TFBGA |
| Date code | 07+ |
| MOQ | No MOQ |
| Lead time | To be confirmed |