S1D13717B00B100

EPSON

S1D13717B00B100 由 EPSON 生产,采用 PFBGA 封装,批号 06+,芯微百年深圳仓库In stock。

In stock
Stock quantity
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Lead time
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MOQ
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Full specifications

S1D13717B00B100 specifications
Parameter Value
Part numberS1D13717B00B100
ManufacturerEPSON
Category编程器BIOS芯片
Stock statusIn stock
PackagePFBGA
Date code06+
MOQNo MOQ
Lead timeTo be confirmed