TC3977

TRANSCOM

TC3977 由 TRANSCOM 生产,采用 HY 封装,批号 07+,芯微百年深圳仓库In stock。

In stock
Stock quantity
—
Lead time
To be confirmed
MOQ
No MOQ

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Full specifications

TC3977 specifications
Parameter Value
Part numberTC3977
ManufacturerTRANSCOM
Category编程器BIOS芯片
Stock statusIn stock
PackageHY
Date code07+
MOQNo MOQ
Lead timeTo be confirmed