W26L010AT-12

WINBOND

W26L010AT-12 由 WINBOND 生产,采用 TSOP 封装,批号 02+,芯微百年深圳仓库In stock。

In stock
Stock quantity
—
Lead time
To be confirmed
MOQ
No MOQ

No public pricing for this part yet — Request a quote.

Request a quote Find alternates

Full specifications

W26L010AT-12 specifications
Parameter Value
Part numberW26L010AT-12
ManufacturerWINBOND
Category编程器BIOS芯片
Stock statusIn stock
PackageTSOP
Date code02+
MOQNo MOQ
Lead timeTo be confirmed