W39L010P-90

Winbond

W39L010P-90 由 Winbond 生产,采用 DIP 封装,批号 02+,芯微百年深圳仓库In stock。

In stock
Stock quantity
—
Lead time
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MOQ
No MOQ

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Full specifications

W39L010P-90 specifications
Parameter Value
Part numberW39L010P-90
ManufacturerWinbond
Category编程器BIOS芯片
Stock statusIn stock
PackageDIP
Date code02+
MOQNo MOQ
Lead timeTo be confirmed