W78E516BF-24

WINBOND

W78E516BF-24 由 WINBOND 生产,采用 TQFP 封装,批号 0631+,芯微百年深圳仓库In stock。

In stock
Stock quantity
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Lead time
To be confirmed
MOQ
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Full specifications

W78E516BF-24 specifications
Parameter Value
Part numberW78E516BF-24
ManufacturerWINBOND
Category编程器BIOS芯片
Stock statusIn stock
PackageTQFP
Date code0631+
MOQNo MOQ
Lead timeTo be confirmed