W78LE516D-24

WINBOND

W78LE516D-24 由 WINBOND 生产,采用 QFP 封装,批号 07+/08+,芯微百年深圳仓库In stock。

In stock
Stock quantity
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Lead time
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MOQ
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Full specifications

W78LE516D-24 specifications
Parameter Value
Part numberW78LE516D-24
ManufacturerWINBOND
Category编程器BIOS芯片
Stock statusIn stock
PackageQFP
Date code07+/08+
MOQNo MOQ
Lead timeTo be confirmed