W93527DG

WINBOND

W93527DG 由 WINBOND 生产,采用 LQFP 封装,批号 05/06+,芯微百年深圳仓库In stock。

In stock
Stock quantity
—
Lead time
To be confirmed
MOQ
No MOQ

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Full specifications

W93527DG specifications
Parameter Value
Part numberW93527DG
ManufacturerWINBOND
Category编程器BIOS芯片
Stock statusIn stock
PackageLQFP
Date code05/06+
MOQNo MOQ
Lead timeTo be confirmed