W78LE365-24

Winbond

W78LE365-24 由 Winbond 生产,采用 DIP 封装,批号 04+,芯微百年深圳仓库In stock 5,000 只。

In stock
Stock quantity
5,000只
Lead time
To be confirmed
MOQ
No MOQ

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Full specifications

W78LE365-24 specifications
Parameter Value
Part numberW78LE365-24
ManufacturerWinbond
Category集成电路(IC)
Stock statusIn stock
PackageDIP
Date code04+
Stock quantity 5,000只
MOQNo MOQ
Lead timeTo be confirmed