W24258Q-70LE

Winbond

W24258Q-70LE 由 Winbond 生产,采用 TSOP-28 封装,批号 04+,芯微百年深圳仓库In stock 5,000 只。

In stock
Stock quantity
5,000只
Lead time
To be confirmed
MOQ
No MOQ

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Full specifications

W24258Q-70LE specifications
Parameter Value
Part numberW24258Q-70LE
ManufacturerWinbond
Category集成电路(IC)
Stock statusIn stock
PackageTSOP-28
Date code04+
Stock quantity 5,000只
MOQNo MOQ
Lead timeTo be confirmed