W27C02-70

WINBOND

W27C02-70 由 WINBOND 生产,采用 DIP-32 封装,批号 03+,芯微百年深圳仓库In stock 5,000 只。

In stock
Stock quantity
5,000只
Lead time
To be confirmed
MOQ
No MOQ

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Full specifications

W27C02-70 specifications
Parameter Value
Part numberW27C02-70
ManufacturerWINBOND
Category未分类
Stock statusIn stock
PackageDIP-32
Date code03+
Stock quantity 5,000只
MOQNo MOQ
Lead timeTo be confirmed