W971GG6JB

WINBOND

W971GG6JB 由 WINBOND 生产,采用 FBGA 封装,批号 11+,芯微百年深圳仓库In stock 2,500 个。

In stock
Stock quantity
2,500个
Lead time
To be confirmed
MOQ
1 个

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Full specifications

W971GG6JB specifications
Parameter Value
Part numberW971GG6JB
ManufacturerWINBOND
Category存储器芯片
Stock statusIn stock
PackageFBGA
Date code11+
Stock quantity 2,500个
MOQ1 个
Lead timeTo be confirmed