BGY887BO

Philips

BGY887BO 由 Philips 生产,采用 模块 封装,批号 19+,芯微百年深圳仓库In stock 5,000 只。

BGY887BO Brand New Original product photo
In stock
Stock quantity
5,000只
Lead time
To be confirmed
MOQ
No MOQ

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Full specifications

BGY887BO specifications
Parameter Value
Part numberBGY887BO
ManufacturerPhilips
Category集成电路(IC)
Stock statusIn stock
Package模块
Date code19+
Stock quantity 5,000只
MOQNo MOQ
Lead timeTo be confirmed