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ADP1707ACPZ-1.8-R7
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ADP1707ACPZ-1.8-R7

  • Category:Voltage regulator
  • Product Name:1 A, low dropout, CMOS linear regulator
  • Manufacturers:Analog Devices
  • Production Batch Number:15+
  • Encapsulation:8 ld LFCSP
  • Stock Status:There is stock
  • Stock Quantity:8760
  • Minimum order quantity: 1
  • Details:点击查找ADP1707ACPZ-1.8-R7的pdf资料
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  • Product introduction

Advantages and features

  • Maximum output current: 1 A
  • Input voltage range: 2.5 V to 5.5 V
  • Low shutdown current: less than 1 μA
  • Low dropout voltage: 345 mV at 1 A load
  • Initial accuracy: ±1%
  • Line, load, and temperature accuracy: ±2.5%
  • Soft-start feature with 16 fixed output voltage options: 0.75 V to 3.3 V (ADP1706)
  • Tracking feature with 16 fixed output voltage options: 0.75 V to 3.3 V (ADP1707)
  • Adjustable output voltage options: 0.8 V to 5.0 V (ADP1708)
  • Stable operation is achieved with a small 4.7 μF ceramic output capacitor
  • Excellent load/line transient response
  • Current limit and thermal overload protection

  • Product details

    ADP1706/ADP1707/ADP1708 are CMOS,Low dropout linear regulatorIt operates from a 2.5 V to 5.5 V supply with a maximum output current of 1 A. These devices feature advanced proprietary architectures that provide high power supply rejection and excellent line and load transient response with a small 4.7 μF ceramic output capacitor.

    The ADP1706/ADP1707 are available in 16 fixed output voltage options, while the ADP1708 is available in adjustable versions that allow the output voltage to be adjusted from 0.8 V to 5.0 V through an external voltage divider. The ADP1706 can be connected to an external soft-start capacitor to program the start-up time; The ADP1707 and ADP1708 have an internal soft-start capacitor with a typical start-up time of 100 μs. The ADP1707 has a tracking feature that allows the output to follow an external voltage rail or reference voltage.

    ADP1706The /ADP1707/ADP1708 are available in two packages: an 8-lead, exposed pad SOIC package, and an 8-lead, 3 mm × 3 mm exposed pad LFCSP package, which is not only very compact, but also has excellent thermal performance for low-profile, small form factor applications requiring up to 1 A output current.

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  • laptop
  • Memory elements
  • Telecommunications equipment
  • Network devices
  • DSP/FPGA/microprocessor power supply
  • Instrumentation/data acquisition system

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