The Allegro™ ACS726 current sensor IC family provides an affordable, accurate solution for AC current sensing in industrial, commercial, and communication systems. The device is designed in a package for ease of customer use. Typical applications include motor control, load detection and management, switching power supplies, and overcurrent fault protection.
The fully differential outputs provide superior output bias drift and common-mode noise resistance.
The ACS726 is the first current sensor IC to include a fully differential back-end amplifier (BEA) that can adjust gain and bandwidth over an external RC network. The BEA is completely self-contained and can be disconnected from power when not in use, reducing power consumption.
The device consists of a low-bias precision linear Hall sensor circuit with a copper current path close to the surface of the wafer. The current applied through this copper current circuit generates a magnetic field that can be sensed by the integrated Hall IC and converted into a proportional voltage. By bringing the magnetic field closer to the Hall sensor, the device accuracy is optimized. The precise proportional voltage is provided by a stable chopper-type low-bias BiCMOS Hall IC that is programmed for accuracy after packaging. As more and more current flows through the copper main current flow path (from pins 1 and 6 to pins 7 and 12), the output of the device is a positive differential voltage (VOUTP – VOUTN). The path described above is the path used by current sensing. The internal resistance of this current flow circuit is typically 1.1 mΩ, which has a low power loss.
The terminal end of the current flow path is electrically isolated from the sensor IC signal wire (pins 13 through 24). This allows the ACS726 current sensor IC to be used in high-side current sensing applications that do not use high-side differential amplifiers or other high-cost insulation technologies.
The ACS726 is available in a small, low-profile surface-mount QSOP24 package (suffix LF). The pin frame is 100% matte tin plated and is compatible with standard lead-free printed circuit board assembly processes. The device does not contain lead inside, with the exception of high-temperature leaded solder balls for flip chips that are currently exempt from the Restriction of Use of Certain Hazardous Substances Directive (RoHS). Devices (excluding BAE) are fully calibrated prior to factory shipment.
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全差分结构可提高抵抗偏置漂移和共模噪声的能力
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备用差分后端放大器使用简单的 RC 网络实现外部可调增益和带宽
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通过专利放大器和滤波器设计工艺大幅提高带宽
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高带宽 120 kHz 模拟输出
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获得专利的集成数字温度补偿电路可在开环传感器中、整个温度范围内实现近乎闭环的精确度
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1.1 mΩ 低功耗和高涌流耐受能力的初级导体电阻
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小尺寸纤薄 QSOP24 封装适合空间有限的应用
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集成屏基本消除了电流导体到晶片之间 dV/dt 高瞬变电压产生的电容耦合
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3 至 3.6 V，单电源供电
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工厂校准灵敏度和静态输出电压用于改进精确度
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稳定斩波器带来极为稳定的静态输出电压
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电源电压的成比例输出
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