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VDD=VDDQ=1.5V +/- 0.075VVDD = VDDQ = 1.5V + / - 0.075V
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Fully differential clock inputs (CK, /CK) operation完全差分时钟输入（CK / CK）的操作
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Differential Data Strobe (DQS, /DQS)差分数据选通（DQS / DQS的）
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On chip DLL align DQ, DQS and /DQS transition with CKtransition在配合芯片的DLL CKtransition DQ，DQS和/ DQS的过渡
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DM masks write data-in at the both rising and fallingedges of the data strobe马克口罩写数据均上升，数据选通fallingedges
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All addresses and control inputs except data,data strobes and data masks latched on therising edges of the clock所有的地址和控制输入数据，数据选通和数据口罩除外的锁存时钟的therising边缘
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Programmable CAS latency 5, 6, 7, 8, 9, 10 and (11)supported支持可编程的CAS延迟5，6，7，8，9，10（11）
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Programmable additive latency 0, CL-1, and CL-2supported可编程附加延迟0，CL - 1和CL - 2supported
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Programmable CAS Write latency (CWL) = 5, 6, 7, 8可编程中科院写入延迟（CWL）= 5，6，7，8
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Programmable burst length 4/8 with both nibblesequential and interleave modenibblesequential和交错模式可编程的突发长度为4 / 8
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BL switch on the fly“基本法”开关上的飞
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8banks8banks
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Average Refresh Cycle(Tcase of 0 °C~ 95 °C)平均更新周期（TCASE 0 ° C〜95 ° C）
- 7.8 µs at 0°C ~ 85 °C- 7.8微秒为0℃〜85℃
- 3.9 µs at 85°C ~ 95 °C- 3.9微秒在85℃〜95℃
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Auto Self Refresh supported自动自刷新支持
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JEDEC standard 82ball FBGA(x4/x8), 96ball FBGA (x16)JEDEC标准82ball FBGA（x4/x8），96ball采用FBGA（X16）
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Driver strength selected by EMRSEMRS选定的驱动强度
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Dynamic On Die Termination supported动态模支持终止
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Asynchronous RESET pin supported支持异步复位引脚
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ZQ calibration supported支持ZQ校准
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TDQS (Termination Data Strobe) supported (x8 only)TDQS（终止数据选通）支持（X8只）
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Write Levelization supported写Levelization支持
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8 bit pre-fetch8位预取
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This product in compliance with the RoHS directive这符合RoHS指令的产品