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LM5118Q1MHX
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LM5118Q1MHX

  • 所属类别:控制器controller
  • 产品名称:升压型控制器
  • 厂商:NSC
  • 生产批号:11+
  • 封装:TSSOP-20
  • 库存状态:有库存
  • 库存量:5000
  • 最低订购量:1
  • 详细资料:点击查找LM5118Q1MHX的pdf资料
  • 点击询价
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  • Product Introduction

peculiarity

  • LM5118Q is automotive-grade and AEC-Q100 qualified (-40°C to 125°C operating junction temperature)
  • The ultra-wide input voltage range is 3V to 75V
  • Analog peak current mode control
  • Smooth transition between buck and boost modes
  • The switching frequency is programmable up to 500kHz
  • Oscillator synchronization function
  • Internal high-voltage bias regulation
  • Integrated high-side and low-side gate drivers
  • Programmable soft-start time
  • Ultra-low shutdown current
  • Enables a bandwidth error amplifier for input width
  • 1.5% feedback reference accuracy
  • Thermal shutdown

illustrate

The LM5118 Wide Voltage Range Buck-Boost Switching Regulator Controller has all the necessary features to achieve a high-performance, low-cost, and efficient buck-boost regulator with minimal external components. The buck-boost topology maintains output voltage regulation when the input voltage is less than or greater than the output voltage, making it particularly suitable for automotive applications. The operation of the LM5118 while the input voltage is sufficient to gradually transition to a larger input voltage than the output voltage and buck-boost mode to a greater input voltage close to the output as a buck regulator. This dual-mode approach maintains over the input voltage over a wide range of regulation for optimal conversion efficiency in buck mode and interference-free output during mode transition. This easy-to-use controller includes drivers for high-side buck MOSFETs and low-side boost MOSFETs. The regulator is controlled using a simulated current ramp control based on the current model. Analog current-mode control reduces the sensitivity of the pulse-width modulation circuit for noise, allowing for reliable control of high input voltage applications with a very small duty cycle necessary. Other protection features include current limiting, thermal shutdown, enable input. The enhanced TSSOP-20 package is available in power devices with an exposed chip bonding pad to help dissipate heat.

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