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LPC1833JET256
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LPC1833JET256

  • 所属类别：控制器controller
  • 产品名称：低成本、低功耗的Cortex-M3 MCU系列产品
  • 厂商：NXP
  • 生产批号：12+
  • 封装：QFP
  • 库存状态：有库存
  • 库存量：320
  • 最低订购量：1
  • 详细资料：点击查找LPC1833JET256的pdf资料
  • 点击询价
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  • Product Introduction

LPC1833JET256 low-cost, low-power Cortex-M3 MCU family products 

NXP's LPC1800 series is the industry's best-performing Cortex-M3 MCU family, running at 180 MHz and offering large on-chip storage and dedicated peripherals, including high-speed USB, SPI Flash interfaces, and state configuration timers.

NXP's LPC1700 series is a high-performance Cortex-M3 MCU family that operates at 120 MHz and offers peripherals such as Ethernet, USB 2.0 host/OTG/device, LCD controller, and CAN 2.0B.

NXP LPC1300 Series is a low-cost, low-power Cortex-M3 MCU family that operates at 72 MHz, offers plug-and-play USB peripheral options, and is pin-to-pin compatible with NXP's LPC1100(X)L Cortex-M0 series.

Key features and benefits:

  • Cortex-M3第2版内核，工作频率高达180 MHz
  • 片内高达1 MB的闪存和高达200 kB的SRAM
  • LPC13xx器件的功耗低至200 µA/MHz
  • 全新唤醒中断控制器(WIC)、可嵌套向量中断控制器(NVIC)和存储器保护单元//www.chip100.com/
  • 可用于诸如以太网、USB主机/OTG/设备、CAN、I2S、超快速模式(Fm+) I2C、12位ADC、电机控制PWM、正交编码器接口等先进的外围设备

LPC1833JET256-related ICs include:


Model Manufacturers lot number encapsulation illustrate
LPC1833JET256 NXP 12+ QFP Low-cost, low-power Cortex-M3 MCU family products

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Model Manufacturers lot number encapsulation illustrate
MY33CTC6L-20-M1SC74B1-(20)-L-PMA JAE Electronics 25+ connector Standard Circular Connector
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8D7C13W35SN SOURIAU-SUNBANK 25+ connector Circular MIL Spec Connector 22P Jam Nut Recpt Sz 13 w/ Skt Cont
216742-0007 MOLEX 25+ connector 216742-0007 $ 2.735 Cross Referenced to MOLEX - Part MOL216742-0007
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MKS2C031001A00KSSD WIMA 25+ DIP Universal film capacitors, metallized PET, radial box type - 2 pins, 0.1 μF, ± 10%, 40 V, 63 V
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ZPF000000000167413 TE 2023+ connector CMC MALE PLUG 02-04 KEY. N W/O CT + M16
CMC36M02-04SNE TE 2023+ connector CMC MALE PLUG 02-04 KEY. N W/O CT

NXP brand product recommendation


Model Manufacturers lot number encapsulation illustrate
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