MSC8256TVT800BPerformanceSix-coreDSP
The MSC8256 is the industry's highest performance DSP core built into StarCore technology and advanced processing based on the needs and capabilities of today's high-performance industrial applications, medical imaging, aerospace, defense and advanced test and measurement markets.Utilizing 45nm process technology, it provides industry-leading performance and power consumption, with a highly integrated system-on-chip (SoC) to deliver a single-core device with performance equivalent to 6 GHz.The MSC8256 helps device manufacturers create end products and services that integrate more functionality in a smaller footprint.
The MSC8256 DSP offers a high level of performance and integration, combined with enhanced fully programmable SC3850 cores, each running up to 1GHz.The SC3850 DSP core has been independently evaluated to make more than 40% of the processing power per MHz competitive with the closest DSP.The high-performance internal RISC-based QUICC Engine subsystem supports multiple network protocols to guarantee reliable data transmission over packet networks while significantly offloading the processing of DSP cores
The MSC8256 embeds a large amount of internal memory to support a variety of advanced, high-speed interface types, including two RapidIO® interfaces, two Gigabit Ethernet interfaces for network communications, and one PCI Express®controller, DDR controller high speed,Industry-standard memory interface and four multi-channel TDM interfaces.The MSC8256 allows for a high degree of scalability through pin compatibility with all MSC825x and MSC815x DSP devices
--------------------------------------------------------------------------------
peculiarity
--------------------------------------------------------------------------------
Six StarCore SC3850 DSP core subsystems, each with:
SC3850 DSP core, up to 1 GHz
512 KB of unified L2 cache/M2 memory
32 KB I-cache, 32 KB D-cache
Fully programmable 1056 KB M3 Common Memory (SRAM)
Two DDR 2/3 64-bit SDRAM interfaces at data rates up to 800 MHz
Chip-level arbitration, non-blocking switching structure, full pipeline, low latency
High-speed interconnection
1.25/2.5/3.125 Gbaud dual 4x/1x serial RapidIO
4x/1x for PCI Express
Two SGMII
QUICC Engine support for dual RISCs
RGMII Gigabit Ethernet port
Serial Peripheral Interface (SPI)
TDM Highway 1024, 400 Mbps, is divided into four ports 256
DMA engine 16 bidirectional channels
Other peripheral interfaces
UART
I²C
32 GPIOs
16-bit timer
technology
Process: 45nm SOI
Voltage: 1,2.5 volt core, 1.8/1.5-volt I/O
Packing: FC-BPGA (29×29) 1mm pitch, RoHS compliant
Microchip 100-year electronic technology --- professionalsensorexpert