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TMP47C1670AN-H007
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Category:Integrated Circuits (ICs)
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Product Name:Remove the board
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Manufacturers:Toshiba
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Production Batch Number:N/A
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Encapsulation:DIP
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Stock Status:There is stock
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Stock Quantity:5000
- Minimum order quantity: 0
- Details:
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Die Demontageplatine TMP47C1670AN-H007 wird von Toshiba unter Verwendung von DIP-Verpackungen hergestellt, Chargennummer N/A, ein jahrhundertealtes Lager für integrierte Schaltkreise mit Mikrochip ist derzeit auf Lager
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DIP |
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