illustrate

In TMS320F2810, TMS320F2811, TMS320F2812, TMS320C2810, TMS320C2811, TMS320C2812 and devices, are members of the TMS320C28x™DSP family and are highly integrated, high-performance solutions for demanding control applications. Section 3, Feature Overview, described in Functional Modules and Memory Mapping.

In this document, TMS320F2810, TMS320F2811, TMS320F2812 are and abbreviated as F2810, F2811, and F2812, respectively. The F281x chip refers to all three flash memory devices. TMS320C2810, TMS320C2811, TMS320C2812 and C2810 are abbreviated as, C2811, C2812 and respectively. C281x represents all three ROM devices. In 2810, the two sides said that F2810 and C2810 devices; 2811 represents two F2811 and C2811 devices, and 2812 represents both F2812 and C2812 equipment.

characteristic

• High-performance static CMOS technology
  • 150 MHz (6.67 - ns cycle time)
  • Low power consumption (1.8 V cores @ 135 MHz, 1.9 - V cores @ 150 MHz, 3.3-six/O) design
• JTAG Boundary Scan Support (1)
• High-performance 32-bit CPU (TMS320C28x™)
  • 16 × 16 and 32 × 32 MAC operations
  • 16 × 16 double MAC
  • Harvard Bus Structure
  • Atomic manipulation
  • Rapid interruption response and processing
  • Unified memory programming model
  • 4 million linear program/data address river sections
  • Code efficiency (in C/C++ and assembly)
  • The TMS320F24x/LF240x source code is compatible with processors
• On-chip memory
  • Flash Devices: Up to 128K × 16 flash (8K four, six 16K × 16× 16 sectors)
  • ROM devices: up to 128K × 16 discs
  • 1K × 16 OTP discs
  • L0, L1 Progress: 2×16 4K per single access RAM block (SARAM)
  • Null hypothesis: 1 is 8K × 16 SARAM