GD50HFL60C1S
POWERSEMI
GD50HFL60C1S 由 POWERSEMI 生产，采用 IGBT模块 封装，批号 08，芯微百年深圳仓库In stock 5,000 只。
In stock
- Stock quantity
- 5,000只
- Lead time
- To be confirmed
- MOQ
- No MOQ
No public pricing for this part yet — Request a quote.
Full specifications
| Parameter | Value |
|---|---|
| Part number | GD50HFL60C1S |
| Manufacturer | POWERSEMI |
| Category | 集成电路(IC) |
| Stock status | In stock |
| Package | IGBT模块 |
| Date code | 08 |
| Stock quantity | 5,000只 |
| MOQ | No MOQ |
| Lead time | To be confirmed |