W972GG6JB-25

WINBOND

W972GG6JB-25 由 WINBOND 生产,采用 WBGA84 封装,批号 2011+,芯微百年深圳仓库In stock 3,000 个。

In stock
Stock quantity
3,000个
Lead time
To be confirmed
MOQ
1 个

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Full specifications

W972GG6JB-25 specifications
Parameter Value
Part numberW972GG6JB-25
ManufacturerWINBOND
Category单片机singlechip
Stock statusIn stock
PackageWBGA84
Date code2011+
Stock quantity 3,000个
MOQ1 个
Lead timeTo be confirmed