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LITE-ON Technology and Japan's Elephantech have created a low-carbon flexible printed circuit board (FPCB) technology for commercial use

Author:Administrator Source:本站 Views:14 Date:2024/1/9 20:15:00

Low-carbon flexible printed circuit board technology is a new type of circuit board manufacturing process with the following characteristics: - The use of biodegradable biomaterials as the substrate reduces environmental pollution and resource consumption - The use of flexible conductive ink as the circuit layer improves electricity

Low-carbon flexible printed circuit board technology is a new type of circuit board manufacturing process with the following characteristics:

- The use of biodegradable materials as substrates reduces environmental pollution and resource consumption
- The use of flexible conductive ink as the circuit layer improves the bendability and reliability of the circuit board
- Precise production of circuit patterns through digital inkjet printing technology, saving materials and energy
- Suitable for a wide range of low-power, low-cost, wearable, and implantable electronic devices

 

(Image source: Lite-On Technology)

LITE-ON Technology Co., Ltd. announced that it has signed a Memorandum of Understanding (MoU) with Elephantech, a Japanese start-up, to jointly advance the commercial development of innovative low-carbon flexible printed circuit board (FPCB) technology. LITE-ON will invest in professional coaching and integration with LITE-ON's abundant global ecosystem resources to further accelerate the practical application of Elephantech's innovative flexible printed circuit board technology in products and processes, and expand into the international market.

As early as 2019, LITE-ON has set clear SBT carbon reduction targets, in addition to actively reducing the impact of greenhouse gas emissions on the environment, it also focuses on low-carbon in its research and development, by increasing the proportion of recycled materials and reducing the use of materials, in order to respond to low-carbon sustainability and enhance carbon competitiveness in an all-round way.

In line with this goal, LITEON-ON announced the establishment of the "LITEON+ Startup Platform" in July this year to support start-up teams and stimulate new business models, and successfully facilitated the signing of a Memorandum of Understanding (MoU) with Elephantech, a Japanese start-up company Co-chaired by Sakaya and Elephantech's CEO Shinya Shimizu, Lite-On Technology will invest in professional mentoring and integrate with LITE-on's abundant global ecosystem resources to further accelerate the practical application of Elephantech's innovative flexible printed circuit board technology to products and processes to expand the international market.

LITE-ON further explained,In 2019, we set clear SBT carbon reduction targets to actively reduce the impact of greenhouse gas emissions on the environment.With low carbon as the core of R&D, we are moving towards the goal of reducing carbon emissions by 5% in the next generation of all LITE-ON products, while increasing the proportion of recycled materials and reducing the use of materials to respond to low-carbon sustainability and enhance carbon competitiveness in an all-round way.LITEON pointed out that through the signing of this memorandum of cooperation, LITEON hopes to work with ecosystem partners to accelerate the development of low-carbon sustainable materials and processes, further expand the influence of sustainability to the supply chain, create common advantages and gain opportunities for low-carbon transformation, and build a second growth curve based on this, accelerate the supply chain towards net-zero carbon emissions, and achieve carbon reduction and common prosperity between LITEON and its supply chain partners.