Low-carbon flexible printed circuit board technology is a new type of circuit board manufacturing process with the following characteristics:
- The use of degradable biomaterials as substrates reduces environmental pollution and resource consumption
- Flexible conductive ink is used as the circuit layer, which improves the bendability and reliability of the circuit board
- Precise production of circuit patterns through digital inkjet printing technology, saving materials and energy
- Suitable for a wide range of low-power, low-cost, wearable and implantable electronic devices
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(Image source: LITE-ON Technology)
LITE-ON Technology announced the signing of a Memorandum of Understanding (MoU) with Japanese start-up Elephantech to jointly promote the commercial development of innovative low-carbon flexible printed circuit board (FPCB) technology. LITE-ON will invest in professional guidance and connect with LITEON's abundant global ecosystem resources to further accelerate the practical application of Elephantech's innovative flexible printed circuit board technology in products and processes, and expand the international market.
As early as 2019, LITE-ON Technology has set a clear SBT carbon reduction target, in addition to actively reducing the impact of greenhouse gas emissions on the environment, it also focuses on low-carbon in research and development, by increasing the proportion of recycled materials and reducing the use of materials, to respond to low-carbon sustainability, so as to enhance carbon competitiveness in an all-round way.
In response to this goal, LITEON Technology announced the establishment of the "LITEON+ Startup Platform" in July this year to support startup teams and stimulate more new business models Co-chaired by Sakaya and Elephantech CEO Shinya Shimizu, LITE-ON will invest in professional guidance and connect with LITEON's abundant global ecosystem resources to further accelerate the practical application of Elephantech's innovative flexible printed circuit board technology in products and processes to expand the international market.
LITEON further explained,In 2019, we set clear SBT carbon reduction targets to actively reduce the impact of greenhouse gas emissions on the environment.With low-carbon as the core of R&D, we are moving towards the goal of reducing carbon emissions by 5% for all LITEON products in the next generation, while increasing the proportion of recycled materials and reducing the use of materials to respond to low-carbon sustainability and enhance carbon competitiveness in an all-round way.LITE-ON pointed out that through the signing of this MOU, LITEON hopes to work with ecosystem partners to accelerate the development of low-carbon sustainable materials and processes, further expand the influence of sustainability to the supply chain, create common advantages and gain opportunities for low-carbon transformation, and build a second growth curve based on this, accelerate the supply chain to move towards net-zero carbon emissions, and achieve carbon reduction and co-prosperity between LITEON and its supply chain partners.