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热点新闻
TI introduces a new generation of radar sensing that supports edge AI
Infineon establishes new business unit to strengthen sensors and
Infineon has built a new back-end factory in Thailand to optimize and optimize
Automotive chips began to be out of stock, and 8M CIS became a "heavy disaster."
Lithography machine giant net sales in the first quarter of ASML2024
Memory chips lead the recovery in demand, and Lanqi and Baiwei are leading the recovery
Cut 5,000 people! After the delisting, Toshiba announced layoffs for the first time
It is reported that Micron is expected to receive a $6.1 billion chip law
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业界新闻
TI introduces a new generation of radar sensors and automotive audio processors that support edge AI to improve the in-car driving experience
(2025-02-27)
Infineon launches new business unit to strengthen its sensor and RF portfolio and drive profitable growth
(2025-02-27)
Infineon has built a new back-end plant in Thailand to optimize and enrich its production layout
(2025-02-27)
Automotive chips began to run out of stock, and 8M CIS became the "hardest hit area"
(2025-02-27)
The lithography machine giant had net sales of 5.3 billion euros in the first quarter of ASML2024
(2024-04-22)
Memory chips led the recovery in demand, and Lanqi and Baiwei benefited from growth
(2024-04-22)
Cut 5,000 people! After delisting, Toshiba reported layoffs for the first time
(2024-04-22)
It is reported that Micron is expected to receive $6.1 billion in chip bill funding
(2024-04-22)
Dolphin Design announced the successful tape-out of the first silicon wafer that supports 12nm FinFet technology
(2024-02-26)
CMOS image sensors provide visual perception for autonomous vehicles
(2024-02-26)
Pricing pressures multiply, EV maker Rivian plans to lay off 10% of its workforce
(2024-02-26)
Global enterprise AI budget in 2023: or soar to more than $1 million
(2024-01-09)
Intel revenue performance analysis and forecast for 2023: Q1 fell 36% to only $11.7 billion, and Q2 may be $12.5 billion
(2024-01-09)
The explosion of the SpaceX rocket launch may have an impact on the semiconductor supply chain of LEO satellites
(2024-01-09)
LITE-ON Technology and Japan's Elephantech have developed low-carbon flexible printed circuit board (FPCB) technology for commercial use
(2024-01-09)
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