Dolphin Design announced the successful tape-out of the first silicon wafer that supports 12nm FinFet technology

Dolphin Design, an industry-leading provider of high-performance analog, mixed-signal, processing intellectual property (IP), and ASIC design, has reached a major milestone by successfully tape-out the first 12nm FinFET test chip with state-of-the-art audio IP.

Creating a dedicated test chip is a key step in establishing Dolphin Design's leadership in power management and audio IP, helping to continuously improve the performance and quality of its products. Dolphin Design continues to improve its expertise in the advanced processes used by its customers, as it was previously done on 22nm node technology. When designing new IP or migrating, describing and mastering the process ensures optimal performance of the chip.

Dolphin Design's insights from test chip development have been key to aligning with the company's aggressive performance roadmap. These gains ensure that IP continues to evolve and meet the growing demand for performance and low power consumption.

The new 12nm FinFet test chip has embedded features including:

• 四个顶级低功耗音频ADC，旨在大幅降低功耗，符合TWS和语音控制设备所预期的功耗水平。
• Dolphin Design的全球最佳且独特的耳机Dç±»DAC，专为提供超低功耗、低延迟和高THD+N而量身设计，并专门针对功耗效率极为关键的TWS开发而成。
• 一款超紧凑型数字PWM DAC，可满足众多需要经济型音频DAC来驱动扬声器放大器的设备。

With a relentless pursuit of technological innovation, Dolphin Design is currently at the forefront of industry-leading technologies.

"With this new family of IPs, Dolphin Design is the first choice for low-power, high-performance audio IP," said Hakim Jaafar, vice president of marketing at Dolphin Design. This achievement underscores our commitment to delivering groundbreaking solutions to our customers and reinforces our commitment to continuous innovation in the semiconductor IP space.