TI introduces a new generation of radar sensors and automotive audio processors that support edge AI to improve the in-car driving experience

News Highlights:

• 德州仪器通过业内先进的单芯片 60GHz 毫米波 (mmWave) 雷达传感器提升检测精度，能够支持三种通过边缘人工智能 (AI) 来实现的车内检测应用。
• 汽车制造商可以通过一款高度集成、基于 Arm®、结合 TI 基于向量的 C7x 数字信号处理器 (DSP) 内核的业界先进的汽车微控制器 (MCU) 和处理器，提供卓越的音频体验。
• TI 的全新音频放大器是业界先进的音频放大器，采用单电感器 (1L) 调制技术，使其能够以一半的电感器数量实现 D 类性能。

Shanghai, China (January 8, 2025) – Texas Instruments (TI) (NASDAQ: TXN) today launched a brand-new integrated automotive chip designed to help drivers and passengers across all price points achieve a safer and more immersive driving experience. The TI AWRL6844 60GHz millimeter-wave radar sensor uses a single chip running edge AI algorithms to support occupancy detection, in-car child detection, and intrusion detection for seat belt reminder systems, thereby creating a safer driving environment. With TI's next-generation audio DSP cores, AM275x-Q1 MCU, and AM62D-Q1 processor, you can enjoy high-quality audio at a more affordable price. Combined with TI's brand-new analog products (including the TAS6754-Q1 Class D audio amplifier), engineers can obtain a complete audio amplification system solution. TI will showcase these devices at the Consumer Electronics Show (CES) in Las Vegas, Nevada, USA, from January 7 to 10, 2025.

"Whether it's entry-level or luxury cars, fuel or electric vehicles, today's drivers expect these vehicles to deliver a better in-car experience," said Amichai Ron, Senior Vice President of TI's Embedded Processing Division. "TI continues to deliver innovative technologies aimed at driving the development and improvement of the future automotive driving experience. Our edge AI radar sensors help automakers enhance vehicle safety and respond quickly to driver actions and needs, while our on-chip audio systems deliver a more immersive audio experience, thereby enhancing driving pleasure. Together, they create a brand-new in-car experience. ” 

The three-in-one radar sensor supporting edge AI improves detection accuracy

Original Equipment Manufacturers (OEMs) are continuously integrating more sensor technologies into automotive designs to enhance the in-car experience and meet evolving safety standards. After using TI's edge AI-supported AWRL6844 60GHz millimeter-wave radar sensors, engineers were able to integrate three in-vehicle detection functions to replace multiple sensor technologies (such as seat weight sensor pads and ultrasonic sensors).

AWRL6844 integrates four transmitters and four receivers, capable of delivering high-resolution detection data and optimized cost, making it ideal for OEM use. The collected data is fed into application-specific AI-driven algorithms, which run on customizable on-chip hardware accelerators and DSPs, thereby improving decision-making accuracy and speeding up data processing. AWRL6844 edge intelligence features of sensors help enhance the driving experience, such as:

• 在行驶过程中，该传感器能够以 98% 的准确率检测和定位车内乘员，从而支持座椅安全带提醒功能。
• 停车后，它使用神经网络技术监控车内是否有无人看管的儿童，并且能够实时检测到车内微小的动作，分类准确率超过 90%。这种直接检测技术可以帮助 OEM 满足 2025 年欧洲新车安全评鉴协会 (Euro NCAP) 的设计要求。
• 当车辆停好时，它通过智能扫描技术来适应不同的环境，从而减少由于车身晃动和外部物体运动所引起的误报。

TI's comprehensive audio product range delivers a superior automotive audio experience

As drivers' expectations for in-car experiences across various models continue to rise, OEMs aim to provide high-quality audio while minimizing design complexity and system costs. The AM275x-Q1 MCU and AM62D-Q1 processor reduce the number of components required for automotive audio amplifier systems by integrating TI's vector-based C7x DSP core, Arm® core, memory, audio networking, and hardware security modules into a functional safety-compliant SoC. The C7x core combined with the matrix multiplication accelerator forms a neural processing unit used to handle both traditional audio algorithms and edge AI-based audio algorithms. These automotive audio SoCs are scalable, allowing designers to choose from entry-level to high-end systems based on different memory and performance needs, requiring minimal redesign and no significant investment.

TI's next-generation C7x DSP core delivers processing performance more than four times that of other audio DSPs, allowing audio engineers to handle more audio functions simultaneously on a single processor core. The AM275x-Q1 MCU and AM62D-Q1 processors feature spatial audio, active noise cancellation, sound synthesis, and advanced in-car networking features (including Ethernet audio-video bridging), enabling an immersive audio experience inside the car.

To further optimize automotive audio design, engineers can use TI's TAS6754-Q1 audio amplifier, which uses innovative 1L modulation technology to deliver excellent audio performance and low power consumption, while halving the number of inductors required compared to existing Class D amplifiers. The TAS67xx-Q1 series integrates real-time load diagnostics required by OEMs, helping engineers simplify design, reduce costs, and improve efficiency, all while ensuring audio quality is not compromised.

CES 2025 TI booth

At CES 2025, TI will showcase how its semiconductor technology is redefining various experiences by achieving higher levels of automation, intelligence, efficiency, and cost-effectiveness. The exhibits include innovations in software-defined vehicles, advanced driver assistance systems, robotics, wearable medical devices, energy infrastructure, and personal electronics. Please visit ti.com/CES for more details.

Packaging and supply status

• AWRL6844、AM2754-Q1、AM62D-Q1 和 TAS6754-Q1 支持预量产，现可通过 TI.com 采购。
• 支持多种付款方式和发货方式。
• 我们为全部四款器件提供了评估模块。