MSC8158SVT1000A DSPBroadband wireless access
MSC8158 target high-bandwidth computing DSP applications and optimized 3G-LTE (FDD and TDD), UMTS and WiMAX systems. The device includes a fully programmable DSP core and powerful hardware acceleration, providing the best combination of best-in-class performance, power efficiency, connectivity, and cost-effectiveness. --------------------------------------------------------------------------------Peculiarity-------------------------------------------------------------------------------- Core frequency up to 48000 MMACS 600 SC3850 cores 1 GHz operation. The kernel subsystem, memory/cache, memory controller, and interrupt controller support several regions. Best-in-class high-speed, non-blocking interconnect architecture to provide optimal throughput between all internal device blocks MAPLE-B2 supports Turbo decoding rate matching, supports 3GLTE up to 330 MB/s, WiMAX at UMTS up to 300 MB/s and Turbo encoded at up to 260 Mbps in octave iteration with information bit encoding rates matched by 900 Mbps for 3GLTE and WiMAX and UMTS up to 450 Mbps Viterratio decodes up to 200 Mbps K=9, zero tailing and up to 175 Mbps K=7 tailing, FFT/IFFT processing, supports up to 960 Msps; DFT/IDFT processing, supports up to 630 MSPS, supports CRC checksum insertion up to 10 Gbps. DMA controller with 16 bidirectional channels for internal data analysis pairs for optimized data throughput during development QUICC Engine subsystem with dual RISC cores supports two SGMII/RGMII interfaces and serial peripheral interface (SPI)Two 4-channel DMA controllers, two serial RapidIO® ports, an enhanced message unit and 8 SerDes channels multiplex one serial RapidIO x4/x2/x1 interface for 5 Gbaud, six CPRI channels, and 2 SGMIIs. 8 programmable hardware signals to manage resources Additional serial interfaces: UART, Timer, I²C, GPIO, Interrupt, and JTAG Power Supply: Nominal I/O power consumption for core supply voltage, 1.0 volts, 1.5 volts, and 2.5 volts rated flip chip plastic ball grid array (FC-PBGA), 783 balls, 1 mm pitch, 29 mm × 29 mm微芯百年电子科技--专业sensor专家